Techniques are described herein for a redundant ball grid array (BGA) scheme to enhance the robustness (reliability and manufacturing) of product design. The BGA scheme involves the placement of mechanical dummy balls at a loosened pitch outside of the BGA field. The design is in a scheme that allows for signal routability in a printed circuit board (PCB), while enhancing the mechanical robustness of a BGA or Land Grid Array (LGA) component.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.