Techniques are described herein for a redundant ball grid array (BGA) scheme to enhance the robustness (reliability and manufacturing) of product design. The BGA scheme involves the placement of mechanical dummy balls at a loosened pitch outside of the BGA field. The design is in a scheme that allows for signal routability in a printed circuit board (PCB), while enhancing the mechanical robustness of a BGA or Land Grid Array (LGA) component.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Ramakrishna, Gnyaneshwar; Ton, Paul; and Patil, Sadanand, "REDUNDANT BALL GRID ARRAY SCHEME TO ENHANCE THE ROBUSTNESS OF PRODUCT DESIGN", Technical Disclosure Commons, (April 09, 2019)