Abstract
A 3D orifice plate for a SERS chip reduces or eliminates air bubble trapping in
the chip.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.
Recommended Citation
INC, HP, "SERS PACKAGING WITH MULTIPLE INLET AND OUTLET FEATURES", Technical Disclosure Commons, (February 14, 2019)
https://www.tdcommons.org/dpubs_series/1955
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