For devices with space constraints or lower heat generating components, connecting the heat generating component to another larger body, such as the enclosure metal, is a common heatsink solution. To ensure that the device antenna can function correctly, electromagnetic noise of the component is usually shielded by encapsulating the component with a grounded metal shield. For efficient heat dissipation, the number of intermediate items in the heat conduction path can be reduced by removing the shield cover or cutting a hole in the shield in order to sandwich a pad of conductive material between the component and the heatsink. While such an approach improves heat dissipation, it has a detrimental effect on the antenna because of the alteration to the electromagnetic interference (EMI) shield cover around the component. This disclosure describes a thermal and desense architecture to improve thermal conduction of high temperature components while incorporating and maintaining appropriate shielding for EMI.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.