For devices with space constraints or lower heat generating components, connecting the heat generating component to another larger body, such as the enclosure metal, is a common heatsink solution. To ensure that the device antenna can function correctly, electromagnetic noise of the component is usually shielded by encapsulating the component with a grounded metal shield. For efficient heat dissipation, the number of intermediate items in the heat conduction path can be reduced by removing the shield cover or cutting a hole in the shield in order to sandwich a pad of conductive material between the component and the heatsink. While such an approach improves heat dissipation, it has a detrimental effect on the antenna because of the alteration to the electromagnetic interference (EMI) shield cover around the component. This disclosure describes a thermal and desense architecture to improve thermal conduction of high temperature components while incorporating and maintaining appropriate shielding for EMI.
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Xue, Yao and Fox, Eugene, "Heat removal from high temperature hardware while shielding electromagnetic interference", Technical Disclosure Commons, (January 08, 2019)