Abstract
For devices with space constraints or lower heat generating components, connecting the heat generating component to another larger body, such as the enclosure metal, is a common heatsink solution. To ensure that the device antenna can function correctly, electromagnetic noise of the component is usually shielded by encapsulating the component with a grounded metal shield. For efficient heat dissipation, the number of intermediate items in the heat conduction path can be reduced by removing the shield cover or cutting a hole in the shield in order to sandwich a pad of conductive material between the component and the heatsink. While such an approach improves heat dissipation, it has a detrimental effect on the antenna because of the alteration to the electromagnetic interference (EMI) shield cover around the component. This disclosure describes a thermal and desense architecture to improve thermal conduction of high temperature components while incorporating and maintaining appropriate shielding for EMI.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Xue, Yao and Fox, Eugene, "Heat removal from high temperature hardware while shielding electromagnetic interference", Technical Disclosure Commons, (January 08, 2019)
https://www.tdcommons.org/dpubs_series/1857