HP INCFollow


The invention is a design for a printed circuit assembly (PCA) retention structure that grounds

the PCA without the use of dedicated components, tools to mount the PCA, or a grounding wire.

This design was developed for a modular sensor PCA which must be installed and replaced by

service technicians in tight spaces that do not accommodate the use of tools. Also, the addition of

dedicated components for grounding would have represented a material cost increase and

negatively impacted the ability to fit the PCA into the available space. The invention greatly

contributes to the long-term robustness and serviceability of the device.

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Creative Commons License
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