Abstract
This document describes a vertical power delivery structure for ultra-high current processing unit applications. The structure includes hollow interposer to interface with point-of-load (PoL) voltage regulator (VR) modules with a motherboard. High frequency decoupling capacitors can be placed on the motherboard bottom inside the interposer hollow.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
"VERTICAL POWER DELIVERY STRUCTURE FOR ULTRA-HIGH CURRENT APPLICATIONS", Technical Disclosure Commons, (September 26, 2018)
https://www.tdcommons.org/dpubs_series/1534
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