This document describes a vertical power delivery structure for ultra-high current processing unit applications. The structure includes hollow interposer to interface with point-of-load (PoL) voltage regulator (VR) modules with a motherboard. High frequency decoupling capacitors can be placed on the motherboard bottom inside the interposer hollow.
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"VERTICAL POWER DELIVERY STRUCTURE FOR ULTRA-HIGH CURRENT APPLICATIONS", Technical Disclosure Commons, (September 26, 2018)