Abstract
3D printers that use powder‐based build materials may be internally exposed to powder dust
contamination. Powder accumulation could eventually lead to electronics malfunction. The printer
should be able to predict electronics failures associated with dust contamination and therefore prevent
unwanted stops that will have a negative impact on productivity. Experience has shown that it is difficult
to prevent powder dust from reaching certain areas of such a 3D printer. Some types of powder are
slightly conductive. Metallic dust aggravates the issue. How could we monitor powder contamination on
our electronics in an affordable way?
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Recommended Citation
INC, HP, "ON-PCA SOLUTION FOR MONITORING POWDER CONTAMINATION ON ELECTRONICS", Technical Disclosure Commons, (September 10, 2018)
https://www.tdcommons.org/dpubs_series/1498