Consumer electronics devices such as laptops, smartphones, etc., typically include speaker modules inside the device. These usually come as an integrated module, e.g., with the speaker and the amplifier driver fully enclosed in a plastic sub-assembly, which in turn is assembled into the main device enclosure. This plastic speaker housing takes up valuable space in all dimensions, limiting how small or slim the main device can be.

This disclosure describes techniques to use a frame mounted on the coverglass of the main device to serve the same purposes as that of the speaker housing. The bare speaker-driver is mounted and sealed directly onto the coverglass and is constrained from moving by the plastic frame that is on the coverglass. In this manner, the space originally occupied by dedicated plastic housing of the speaker is released, enabling slimmer mobile devices or the mounting of additional componentry.

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This work is licensed under a Creative Commons Attribution 4.0 License.