In the currently available form, integrating a Universal Serial Bus Type C (USB-C) receptacle into a device affects the device thickness and forces the device to have large display borders. This disclosure enables provision of a USB-C receptacle in a thin profile device underneath a display stack. The techniques, as disclosed herein, eliminate the outer shell of the USB-C receptacle and use the primary enclosure of a connected device, e.g., a phone, as the outer shell. An O-ring, attached to a ground shield/shell of the USB-C receptacle, interfaces with the primary enclosure of the connected device to maintain a waterproof seal.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.