This document proposes a solution to the problem of fluctuations in voltage supply voltages due to changing current demands of power-hungry integrated circuits (ICs) such as microprocessors, application-specific integrated circuits (ASICs), and field-programmable gate arrays (FPGAs). By fabricating the IC with additional layers including a massive capacitor, such as a deep-trench capacitor, di/dt voltage ripple can be reduced to a negligible level. Two configurations of massive on-die capacitors are proposed, including a wafer-to-wafer configuration, where a capacitor wafer substantially underlies the entire IC, and a chip-to-wafer configuration, where smaller capacitors are placed underneath regions of the IC with the highest current fluctuations, surrounded by dielectric.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.