This document proposes a solution to the problem of fluctuations in voltage supply voltages due to changing current demands of power-hungry integrated circuits (ICs) such as microprocessors, application-specific integrated circuits (ASICs), and field-programmable gate arrays (FPGAs). By fabricating the IC with additional layers including a massive capacitor, such as a deep-trench capacitor, di/dt voltage ripple can be reduced to a negligible level. Two configurations of massive on-die capacitors are proposed, including a wafer-to-wafer configuration, where a capacitor wafer substantially underlies the entire IC, and a chip-to-wafer configuration, where smaller capacitors are placed underneath regions of the IC with the highest current fluctuations, surrounded by dielectric.
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Kim, Woonseong; Gan, Houle; and Kang, Teckgyu, "Massive On-Die Capacitor for Integrated Circuits", Technical Disclosure Commons, (April 10, 2018)