Abstract
Every computer system has different components layout placement, the CPU baffle is one of the approaches to cooling the processor. Disclosed is a new idea for modularizing the CPU baffle. Assembling by two plastic parts which can fulfill product thermal performance required by different direction combination. The new design also can save some tooling money investment.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Noncommercial-No Derivative Works 4.0 License.
Recommended Citation
Ko, Tim, "New modularizing CPU baffle", Technical Disclosure Commons, (March 08, 2018)
https://www.tdcommons.org/dpubs_series/1083