This patent suggest to add a transient thermal solution to the existing steady state solution. The suggested transient thermal solution is a phase change material heat sink (PCM HS) to be added to the existing heat sink (assuming an air-cooled heat sink is already in place). A heat pipe to be utilized to connect the PCM HS to the existing heat sink. The heat pipe should have the capacity to transfer the max amount of heat dissipated by the component. The PCM heatsink contain PCM between its fins, and it is sealed to prevent leakage. When sudden power increase is experienced the heat will be transferred through the heat pipe to the PCM HS to be absorbed by the PCM, causing an instant melting of the PCM and preventing a steep rise in component temperature giving the fans more time to gain control of the temperature.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution-Noncommercial-No Derivative Works 4.0 License.