Abstract

The construction of housings for computing devices is governed by strict regulations. Certain materials (e.g., metal materials) used for a surface of the housing must not exceed a first threshold temperature, while other materials (e.g., plastic materials) used for a surface of the housing must not exceed a second threshold temperature that is greater than the first threshold temperature. Metal materials have a higher thermal conductivity than plastic materials and therefore are better at dissipating heat from the computing device. By constructing the housing of a computing device with a metal layer that is overlaid with a plastic mesh, the advantageous heat dissipation characteristics of the metal material can be utilized at a higher temperature that is permitted by the use of the plastic mesh material in the outermost layer of the housing.

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