Abstract
Conventional cold plate designs that utilize skived or machined fins face performance and design limitations due to constraints in fin thickness, pitch, and material choice. This disclosure describes a cold plate design that utilizes compressible thermally conductive foam or alternative three-dimensional (3D) conductive structures in place of traditional fins. The foam is constructed from materials such as copper, carbon, or graphene, and can enhance heat dissipation by offering increased surface area and variable density across the coolant flow path. The design allows precise thermal control by matching foam materials to the cooling needs to specific chip regions and can achieve consistent temperatures across areas with varying power densities. The compressible foam eliminates the need for silicone diverters, streamlining assembly and reducing precision required in manufacturing. The described compressible thermally conductive foam cold plate can enhance cooling efficiency without altering coolant flow rate, type, or temperature, offering a cost-effective solution for thermal management.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Compressible Thermally Conductive Foam Cold Plate", Technical Disclosure Commons, (December 05, 2024)
https://www.tdcommons.org/dpubs_series/7628