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Abstract

Indirect cooling method for power electronics, such as inverters, typically involves transferring heat away from the components without direct contact with the cooling medium. They are not very efficient for high power applications and often demand higher creepage and clearances between the components of the PCB. The proposed solution uses a direct cooling approach by flooding the power electronics PCBs with refrigerant. This direct contact cooling not only improves the cooling efficiency but also reduces overall packaging size by reducing the creepage clearances.

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Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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