High temperature drives electronic devices to unreliability. Recent trends of increasing device power levels and transistor density, both leading to higher device temperature, compound the device failure rate, or equivalently, the annual swap rate (ASR) of devices. This disclosure describes techniques to increase the reliability of data center electronics by optimally directing coolant flows and manipulating temperature set-points to overcool the electronics. In cases where overcooling consumes more energy, the cost of the increased energy is offset by a reduced ASR, thereby leading to a reduced total cost of operation (TCO).
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N/A, "Cooling Stack Optimization For Increased Device Reliability", Technical Disclosure Commons, (October 29, 2020)